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  december 2010 doc id 17935 rev 1 1/9 9 STPS1H100-Y automotive high voltage power schottky rectifier features negligible switching losses high junction temperature capability low leakage current good trade-off between leakage current and forward voltage drop avalanche capability specified ecopack ? 2 compliant component aec-q101 qualified description schottky rectifiers packaged in sma or smb, and designed for high frequency miniature switched mode power supplies as dc/dc converters for automotive applications. table 1. device summary symbol value i f(av) 1 a v rrm 100 v t j (max) 175 c v f (max) 0.62 v k a k a sma (jedec do-214ac) stps1h100ay smb (jedec do-214aa) stps1h100uy www.st.com
characteristics STPS1H100-Y 2/9 doc id 17935 rev 1 1 characteristics to evaluate the conduction losses use the following equation: p = 0.54 x i f(av) + 0.08 i f 2 (rms) table 2. absolute ratings (limiting values) symbol parameter value unit v rrm repetitive peak reverse voltage 100 v i f(rms) forward rms voltage 10 a i f(av) average forward current t l = 160 c = 0.5 1 a i fsm surge non repetitive forward current t p =10 ms sinusoidal 50 a i rrm repetitive peak reverse current t p = 2 s f = 1 khz square 1 a i rsm non repetitive peak reverse current t p = 100 s square 1 a p arm repetitive peak avalanche power t p = 1 s t j = 25 c 1500 w t stg storage temperature range - 65 to + 175 c t j operating junction temperature (1) 1. condition to avoid thermal runaway for a diode on its own heatsink - 40 to + 175 c dv/dt critical rate of rise of reverse voltage 10000 v/s table 3. thermal resistance symbol parameter value unit r th(j-l) junction to lead sma 30 c/w smb 25 table 4. static electrical characteristics symbol parameter test conditions min. typ. max. unit i r (1) 1. pulse test: t p = 5 ms, < 2% reverse leakage current t j = 25 c v r = v rrm 4a t j = 125 c 0.2 0.5 ma v f (2) 2. pulse test: t p = 380 s, < 2% forward voltage drop t j = 25 c i f = 1 a 0.77 v t j = 125 c 0.58 0.62 t j = 25 c i f = 2 a 0.86 t j = 125 c 0.65 0.7 dptot dtj < 1 rth(j-a)
STPS1H100-Y characteristics doc id 17935 rev 1 3/9 figure 1. average forward power dissipation versus average forward current figure 2. average forward current versus ambient temperature ( = 0.5) p (w) f(av) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 t =tp/t tp i (a) f(av) = 1 = 0.1 = 0.05 = 0.5 = 0.2 i (a) f(av) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 0 25 50 75 100 125 150 175 r th(j-a) =r th(j-l) t =tp/t tp r th(j-a) =100c/w r th(j-a) =120c/w sma smb r th(j-a) =200c/w t (c) amb figure 3. normalized avalanche power derating versus pulse duration figure 4. normalized avalanche power derating versus junction temperature 0.001 0.01 0.1 0.01 1 0.1 10 100 1000 1 p(t p ) p (1s) arm arm t (s) p 0 0.2 0.4 0.6 0.8 1 1.2 25 50 75 100 125 150 p(t) p (25 c) arm j arm t (c) j figure 5. non repetitive surge peak forward current versus overload duration (maximum values) (smb) figure 6. non repetitive surge peak forward current versus overload duration (maximum values) (sma) i (a) m 0 1 2 3 4 5 6 7 8 9 10 1.e-03 1.e-02 1.e-01 1.e+00 t a =25 c t a =75 c t a =110 c i m t =0.5 smb t(s) i (a) m 0 1 2 3 4 5 6 7 8 1.e-03 1.e-02 1.e-01 1.e+00 t a =25 c t a =75 c t a =110 c i m t =0.5 sma t(s)
characteristics STPS1H100-Y 4/9 doc id 17935 rev 1 figure 7. relative variation of thermal impedance junction to ambient versus pulse duration (smb) figure 8. relative variation of thermal impedance junction to ambient versus pulse duration (sma) z/r th(j-c) th(j-c) 0.01 0.10 1.00 1.e-03 1.e-02 1.e-01 1.e+00 1.e+01 1.e+02 1.e+03 single pulse smb t (s) p z/r th(j-c) th(j-c) 0.01 0.10 1.00 1.e-03 1.e-02 1.e-01 1.e+00 1.e+01 1.e+02 1.e+03 single pulse sma t (s) p figure 9. reverse leakage current versus reverse voltage applied (typical values) figure 10. junction capacitance versus reverse voltage applied (typical values) i (a) r 1.e-03 1.e-02 1.e-01 1.e+00 1.e+01 1.e+02 1.e+03 0 102030405060708090100 t j =125 c t j =25 c v (v) r c(pf) 10 100 1 10 100 f=1 mhz v osc =30 mv rms t j =25 c v (v) r figure 11. forward voltage drop versus forward current (maximum values) figure 12. thermal resistance junction to ambient versus copper surface under each lead (smb) i (a) fm 0.01 0.10 1.00 10.00 100.00 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 t j =25 c t j =125 c v (v) fm r (c/w) th(j-a) 20 30 40 50 60 70 80 90 100 110 120 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 smb s(cu)(cm2) epoxy printed circuit board fr4, copper thickn ess: 35 m
STPS1H100-Y characteristics doc id 17935 rev 1 5/9 figure 13. thermal resistance junction to ambient versus copper surface under each lead (sma) r (c/w) th(j-a) 20 30 40 50 60 70 80 90 100 110 120 130 140 0 . 00 . 5 1. 0 1. 5 2. 0 2. 53 . 03 . 5 4. 0 4. 55 . 0 sma s(cu)(cm2) epoxy printed circuit board fr4, copper thickness: 35 m
package information STPS1H100-Y 6/9 doc id 17935 rev 1 2 package information epoxy meets ul94, v0 lead-free package in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 14. sma package dimensions figure 15. sma footprint dimensions in millimeters (inches) ref dimensions millimeters inches min. max. min. max. a1 1.90 2.45 0.075 0.094 a2 0.05 0.20 0.002 0.008 b 1.25 1.65 0.049 0.065 c 0.15 0.40 0.006 0.016 d 2.25 2.90 0.089 0.114 e 4.80 5.35 0.189 0.211 e1 3.95 4.60 0.156 0.181 l 0.75 1.50 0.030 0.059 e c l e1 d a1 a2 b 2.63 (0.103) 5.43 (0.214) 1.4 1.64 (0.064) 1.4 (0.055) (0.055)
STPS1H100-Y package information doc id 17935 rev 1 7/9 figure 16. smb package dimensions figure 17. smb footprint dimensions in millimeters (inches) ref dimensions millimeters inches min. max. min. max. a1 1.90 2.45 0.075 0.096 a2 0.05 0.20 0.002 0.008 b 1.95 2.20 0.077 0.087 c 0.15 0.40 0.006 0.016 d 3.30 3.95 0.130 0.156 e 5.10 5.60 0.201 0.220 e1 4.05 4.60 0.159 0.181 l 0.75 1.50 0.030 0.059 e c l e1 d a1 a2 b 2.60 5.84 1.62 2.18 1.62 (0.064) (0.102) (0.300) (0.064) (0.086)
ordering information STPS1H100-Y 8/9 doc id 17935 rev 1 3 ordering information 4 revision history table 5. ordering information order code marking package weight base qty delivery mode stps1h100ay s11y sma 0.068 g 5000 tape and reel stps1h100uy g11y smb 0.107 g 2500 tape and reel table 6. document revision history date revision changes 03-dec-2010 1 first issue.
STPS1H100-Y doc id 17935 rev 1 9/9 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by an authorized st representative, st products are not recommended, authorized or warranted for use in milita ry, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2010 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com


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